This expansion, the third of its kind, will double our capacity and improve standards across all production lines.
At Iskraemeco, our commitment goes beyond capacity expansion. We are also committed to improving in-process quality control. As part of our global approach, we have integrated Koh Young’s 3D SPI (Solder Paste Inspection) technology and upgraded all SMT production lines with 3D AOI (Automatic Optical Inspection) technologies. Koh Young is a provider of 3D measurement and inspection technology in the production of electronic assemblies.
These improvements ensure greater quality and efficiency in our PCBA (Printed Circuit Board Assembly) manufacturing processes. This achievement underscores Iskraemeco’s strategic vision for growth and expansion and solidifies our partnerships with industry leaders such as ASMPT, ASYS, KOH Young Technology, ITW EAE Vitronics Soltec, YJ LINK, Adelec International and Sigma Group Egypt.
